ELECTRONIC DEVICE

The present description concerns an electronic device (100, 200) comprising: an electronic chip (102) assembled on a first region (109) of a substrate (107) of the electronic device;a first layer (105, 142, 205) of a first coating material covering at least a surface of the electronic chip (102) fac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PTAK, Olivier, HAJJI, Ouafa, KIMMICH, Georg
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present description concerns an electronic device (100, 200) comprising: an electronic chip (102) assembled on a first region (109) of a substrate (107) of the electronic device;a first layer (105, 142, 205) of a first coating material covering at least a surface of the electronic chip (102) facing away from the substrate (107); and a radiation element (106) of an antenna of the electronic device separated from the substrate (107) by at least a portion of the first coating layer (105, 142, 205) and being offset with respect to the first region (109) of the substrate (107) so that the radiation element (106) does not cover the electronic chip (102), the radiation element (106) being buried in the first coating layer (105, 142, 205) or being arranged in the first coating layer (105, 142, 205) and at least partly covered with a protection material (210) .