HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embod...

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Bibliographische Detailangaben
Hauptverfasser: YEUNG, Lily, FITZPATRICK, Richard, HODGE, Ronald, HAN, Alan, ZADEREJ, Victor, O'CONNOR, Gary
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.