METAL PCB FOR TOPSIDE POWER DELIVERY
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the p...
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| creator | JOSEPHSON, Don Douglas RADHAKRISHNAN, Kaladhar ARRINGTON, Kyle SHAN, Bohan FENG, Hongxia Liu, Kuang C MOREIN, Stephen |
| description | Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator. |
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In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231004&DB=EPODOC&CC=EP&NR=4254484A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231004&DB=EPODOC&CC=EP&NR=4254484A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOSEPHSON, Don Douglas</creatorcontrib><creatorcontrib>RADHAKRISHNAN, Kaladhar</creatorcontrib><creatorcontrib>ARRINGTON, Kyle</creatorcontrib><creatorcontrib>SHAN, Bohan</creatorcontrib><creatorcontrib>FENG, Hongxia</creatorcontrib><creatorcontrib>Liu, Kuang C</creatorcontrib><creatorcontrib>MOREIN, Stephen</creatorcontrib><title>METAL PCB FOR TOPSIDE POWER DELIVERY</title><description>Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDxdQ1x9FEIcHZScPMPUgjxDwj2dHFVCPAPdw1ScHH18QxzDYrkYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmRqYmJhYmjobGRCgBAC1PIok</recordid><startdate>20231004</startdate><enddate>20231004</enddate><creator>JOSEPHSON, Don Douglas</creator><creator>RADHAKRISHNAN, Kaladhar</creator><creator>ARRINGTON, Kyle</creator><creator>SHAN, Bohan</creator><creator>FENG, Hongxia</creator><creator>Liu, Kuang C</creator><creator>MOREIN, Stephen</creator><scope>EVB</scope></search><sort><creationdate>20231004</creationdate><title>METAL PCB FOR TOPSIDE POWER DELIVERY</title><author>JOSEPHSON, Don Douglas ; RADHAKRISHNAN, Kaladhar ; ARRINGTON, Kyle ; SHAN, Bohan ; FENG, Hongxia ; Liu, Kuang C ; MOREIN, Stephen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4254484A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JOSEPHSON, Don Douglas</creatorcontrib><creatorcontrib>RADHAKRISHNAN, Kaladhar</creatorcontrib><creatorcontrib>ARRINGTON, Kyle</creatorcontrib><creatorcontrib>SHAN, Bohan</creatorcontrib><creatorcontrib>FENG, Hongxia</creatorcontrib><creatorcontrib>Liu, Kuang C</creatorcontrib><creatorcontrib>MOREIN, Stephen</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOSEPHSON, Don Douglas</au><au>RADHAKRISHNAN, Kaladhar</au><au>ARRINGTON, Kyle</au><au>SHAN, Bohan</au><au>FENG, Hongxia</au><au>Liu, Kuang C</au><au>MOREIN, Stephen</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METAL PCB FOR TOPSIDE POWER DELIVERY</title><date>2023-10-04</date><risdate>2023</risdate><abstract>Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | METAL PCB FOR TOPSIDE POWER DELIVERY |
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