METAL PCB FOR TOPSIDE POWER DELIVERY

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the p...

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Bibliographische Detailangaben
Hauptverfasser: JOSEPHSON, Don Douglas, RADHAKRISHNAN, Kaladhar, ARRINGTON, Kyle, SHAN, Bohan, FENG, Hongxia, Liu, Kuang C, MOREIN, Stephen
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.