HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to...

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Hauptverfasser:	VADLIMANI, Sai, DUAN, Gang, LI, Xiaoqian, PAITAL, Sameer, BROWN, Kenneth, POTHUKUCHI, Suresh V, PIETAMBARAM, Srinivas V, SHARAN, Sujit, MANEPALLI, Rahul N, DESHPANDE, Nitin, ECTON, Jeremy, NIE, Bai, AYGÜN, Kemal, DOBRIYAL, Priyanka, DARMAWIKARTA, Kristof, GAMBA, Jason M, MANSURI, Mozhgan, MAHAJAN, Ravindranath V, JAUSSI, James E, AGRAWAL, Ankar, KARHADE, Omkar, PRATAP, Divya, CASPER, Bryan K, MALLIK, Debendra, ZHANG, Zhichao, SARKAR, Arnab, INTI, Rajesh, JADHAV, Susheel, MARIN, Brandon C
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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