HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to...
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| creator | VADLIMANI, Sai DUAN, Gang LI, Xiaoqian PAITAL, Sameer BROWN, Kenneth POTHUKUCHI, Suresh V PIETAMBARAM, Srinivas V SHARAN, Sujit MANEPALLI, Rahul N DESHPANDE, Nitin ECTON, Jeremy NIE, Bai AYGÜN, Kemal DOBRIYAL, Priyanka DARMAWIKARTA, Kristof GAMBA, Jason M MANSURI, Mozhgan MAHAJAN, Ravindranath V JAUSSI, James E AGRAWAL, Ankar KARHADE, Omkar PRATAP, Divya CASPER, Bryan K MALLIK, Debendra ZHANG, Zhichao SARKAR, Arnab INTI, Rajesh JADHAV, Susheel MARIN, Brandon C |
| description | Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate. |
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In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230927&DB=EPODOC&CC=EP&NR=4248249A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230927&DB=EPODOC&CC=EP&NR=4248249A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VADLIMANI, Sai</creatorcontrib><creatorcontrib>DUAN, Gang</creatorcontrib><creatorcontrib>LI, Xiaoqian</creatorcontrib><creatorcontrib>PAITAL, Sameer</creatorcontrib><creatorcontrib>BROWN, Kenneth</creatorcontrib><creatorcontrib>POTHUKUCHI, Suresh V</creatorcontrib><creatorcontrib>PIETAMBARAM, Srinivas V</creatorcontrib><creatorcontrib>SHARAN, Sujit</creatorcontrib><creatorcontrib>MANEPALLI, Rahul N</creatorcontrib><creatorcontrib>DESHPANDE, Nitin</creatorcontrib><creatorcontrib>ECTON, Jeremy</creatorcontrib><creatorcontrib>NIE, Bai</creatorcontrib><creatorcontrib>AYGÜN, Kemal</creatorcontrib><creatorcontrib>DOBRIYAL, Priyanka</creatorcontrib><creatorcontrib>DARMAWIKARTA, Kristof</creatorcontrib><creatorcontrib>GAMBA, Jason M</creatorcontrib><creatorcontrib>MANSURI, Mozhgan</creatorcontrib><creatorcontrib>MAHAJAN, Ravindranath V</creatorcontrib><creatorcontrib>JAUSSI, James E</creatorcontrib><creatorcontrib>AGRAWAL, Ankar</creatorcontrib><creatorcontrib>KARHADE, Omkar</creatorcontrib><creatorcontrib>PRATAP, Divya</creatorcontrib><creatorcontrib>CASPER, Bryan K</creatorcontrib><creatorcontrib>MALLIK, Debendra</creatorcontrib><creatorcontrib>ZHANG, Zhichao</creatorcontrib><creatorcontrib>SARKAR, Arnab</creatorcontrib><creatorcontrib>INTI, Rajesh</creatorcontrib><creatorcontrib>JADHAV, Susheel</creatorcontrib><creatorcontrib>MARIN, Brandon C</creatorcontrib><title>HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES</title><description>Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDx8HT3UHBy9HMJ93QJ8VDwDwjxdHb0UfD0C3ENcvb383N1DvH091NwDHL28AwBckKDXIN5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CJkYmFkYmlo6ExEUoAlFAnTg</recordid><startdate>20230927</startdate><enddate>20230927</enddate><creator>VADLIMANI, Sai</creator><creator>DUAN, Gang</creator><creator>LI, Xiaoqian</creator><creator>PAITAL, Sameer</creator><creator>BROWN, Kenneth</creator><creator>POTHUKUCHI, Suresh V</creator><creator>PIETAMBARAM, Srinivas V</creator><creator>SHARAN, Sujit</creator><creator>MANEPALLI, Rahul N</creator><creator>DESHPANDE, Nitin</creator><creator>ECTON, Jeremy</creator><creator>NIE, Bai</creator><creator>AYGÜN, Kemal</creator><creator>DOBRIYAL, Priyanka</creator><creator>DARMAWIKARTA, Kristof</creator><creator>GAMBA, Jason M</creator><creator>MANSURI, Mozhgan</creator><creator>MAHAJAN, Ravindranath V</creator><creator>JAUSSI, James E</creator><creator>AGRAWAL, Ankar</creator><creator>KARHADE, Omkar</creator><creator>PRATAP, Divya</creator><creator>CASPER, Bryan K</creator><creator>MALLIK, Debendra</creator><creator>ZHANG, Zhichao</creator><creator>SARKAR, Arnab</creator><creator>INTI, Rajesh</creator><creator>JADHAV, Susheel</creator><creator>MARIN, Brandon C</creator><scope>EVB</scope></search><sort><creationdate>20230927</creationdate><title>HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES</title><author>VADLIMANI, Sai ; DUAN, Gang ; LI, Xiaoqian ; PAITAL, Sameer ; BROWN, Kenneth ; POTHUKUCHI, Suresh V ; PIETAMBARAM, Srinivas V ; SHARAN, Sujit ; MANEPALLI, Rahul N ; DESHPANDE, Nitin ; ECTON, Jeremy ; NIE, Bai ; AYGÜN, Kemal ; DOBRIYAL, Priyanka ; DARMAWIKARTA, Kristof ; GAMBA, Jason M ; MANSURI, Mozhgan ; MAHAJAN, Ravindranath V ; JAUSSI, James E ; AGRAWAL, Ankar ; KARHADE, Omkar ; PRATAP, Divya ; CASPER, Bryan K ; MALLIK, Debendra ; ZHANG, Zhichao ; SARKAR, Arnab ; INTI, Rajesh ; JADHAV, Susheel ; MARIN, Brandon C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4248249A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>VADLIMANI, Sai</creatorcontrib><creatorcontrib>DUAN, Gang</creatorcontrib><creatorcontrib>LI, Xiaoqian</creatorcontrib><creatorcontrib>PAITAL, Sameer</creatorcontrib><creatorcontrib>BROWN, Kenneth</creatorcontrib><creatorcontrib>POTHUKUCHI, Suresh V</creatorcontrib><creatorcontrib>PIETAMBARAM, Srinivas V</creatorcontrib><creatorcontrib>SHARAN, Sujit</creatorcontrib><creatorcontrib>MANEPALLI, Rahul N</creatorcontrib><creatorcontrib>DESHPANDE, Nitin</creatorcontrib><creatorcontrib>ECTON, Jeremy</creatorcontrib><creatorcontrib>NIE, Bai</creatorcontrib><creatorcontrib>AYGÜN, Kemal</creatorcontrib><creatorcontrib>DOBRIYAL, Priyanka</creatorcontrib><creatorcontrib>DARMAWIKARTA, Kristof</creatorcontrib><creatorcontrib>GAMBA, Jason M</creatorcontrib><creatorcontrib>MANSURI, Mozhgan</creatorcontrib><creatorcontrib>MAHAJAN, Ravindranath V</creatorcontrib><creatorcontrib>JAUSSI, James E</creatorcontrib><creatorcontrib>AGRAWAL, Ankar</creatorcontrib><creatorcontrib>KARHADE, Omkar</creatorcontrib><creatorcontrib>PRATAP, Divya</creatorcontrib><creatorcontrib>CASPER, Bryan K</creatorcontrib><creatorcontrib>MALLIK, Debendra</creatorcontrib><creatorcontrib>ZHANG, Zhichao</creatorcontrib><creatorcontrib>SARKAR, Arnab</creatorcontrib><creatorcontrib>INTI, Rajesh</creatorcontrib><creatorcontrib>JADHAV, Susheel</creatorcontrib><creatorcontrib>MARIN, Brandon C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VADLIMANI, Sai</au><au>DUAN, Gang</au><au>LI, Xiaoqian</au><au>PAITAL, Sameer</au><au>BROWN, Kenneth</au><au>POTHUKUCHI, Suresh V</au><au>PIETAMBARAM, Srinivas V</au><au>SHARAN, Sujit</au><au>MANEPALLI, Rahul N</au><au>DESHPANDE, Nitin</au><au>ECTON, Jeremy</au><au>NIE, Bai</au><au>AYGÜN, Kemal</au><au>DOBRIYAL, Priyanka</au><au>DARMAWIKARTA, Kristof</au><au>GAMBA, Jason M</au><au>MANSURI, Mozhgan</au><au>MAHAJAN, Ravindranath V</au><au>JAUSSI, James E</au><au>AGRAWAL, Ankar</au><au>KARHADE, Omkar</au><au>PRATAP, Divya</au><au>CASPER, Bryan K</au><au>MALLIK, Debendra</au><au>ZHANG, Zhichao</au><au>SARKAR, Arnab</au><au>INTI, Rajesh</au><au>JADHAV, Susheel</au><au>MARIN, Brandon C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES</title><date>2023-09-27</date><risdate>2023</risdate><abstract>Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES |
| title | HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES |
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