HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to...

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Bibliographische Detailangaben
Hauptverfasser:	VADLIMANI, Sai, DUAN, Gang, LI, Xiaoqian, PAITAL, Sameer, BROWN, Kenneth, POTHUKUCHI, Suresh V, PIETAMBARAM, Srinivas V, SHARAN, Sujit, MANEPALLI, Rahul N, DESHPANDE, Nitin, ECTON, Jeremy, NIE, Bai, AYGÜN, Kemal, DOBRIYAL, Priyanka, DARMAWIKARTA, Kristof, GAMBA, Jason M, MANSURI, Mozhgan, MAHAJAN, Ravindranath V, JAUSSI, James E, AGRAWAL, Ankar, KARHADE, Omkar, PRATAP, Divya, CASPER, Bryan K, MALLIK, Debendra, ZHANG, Zhichao, SARKAR, Arnab, INTI, Rajesh, JADHAV, Susheel, MARIN, Brandon C
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.