JOINED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

A joined body according to an embodiment is provided with a ceramic substrate, a copper plate and a joint layer. The joint layer is arranged on at least one surface of the ceramic substrate and joins the ceramic substrate and the copper plate to each other. The joint layer contains Ag and Ti. The co...

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Bibliographische Detailangaben
Hauptverfasser: SUENAGA, Seiichi, SANO, Takashi, FUJISAWA, Sachiko, YONETSU, Maki
Format: Patent
Sprache:eng ; fre ; ger
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