PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS

A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, Xiao, PRENGER, Luke M, MARTINEZ, Xavier, PULIGADDA, Rama
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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