ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD
An electronic device according to one embodiment of the present document comprises: a housing including the front surface of the electronic device, the rear surface of the electronic device, and side surfaces surrounding at least a part of the space between the front surface and the rear surface; an...
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| creator | KIM, Gidae BAEK, Moohyun |
| description | An electronic device according to one embodiment of the present document comprises: a housing including the front surface of the electronic device, the rear surface of the electronic device, and side surfaces surrounding at least a part of the space between the front surface and the rear surface; and a display which is positioned in the space, and of which at least a part is visible through the front surface, wherein the housing comprises an outer structure, which includes a first metal material and forms at least a part of the side surfaces, an inner structure, which includes a second metal material different from the first metal material and is positioned in the space, and a non-conductive structure, which includes a polymer and is connected to the outer structure and the inner structure, and the outer structure and the inner structure can be electrically connected at position overlapping with an opening formed in the non-conductive structure. Various other embodiments are possible. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4228228A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4228228A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4228228A13</originalsourceid><addsrcrecordid>eNrjZHB19XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNX8PAPDQbSOgqOfi4wjoKvo1-om6NzSGgQmOca4uHvwsPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIyMLIDI0dCYCCUAMRgrrw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD</title><source>esp@cenet</source><creator>KIM, Gidae ; BAEK, Moohyun</creator><creatorcontrib>KIM, Gidae ; BAEK, Moohyun</creatorcontrib><description>An electronic device according to one embodiment of the present document comprises: a housing including the front surface of the electronic device, the rear surface of the electronic device, and side surfaces surrounding at least a part of the space between the front surface and the rear surface; and a display which is positioned in the space, and of which at least a part is visible through the front surface, wherein the housing comprises an outer structure, which includes a first metal material and forms at least a part of the side surfaces, an inner structure, which includes a second metal material different from the first metal material and is positioned in the space, and a non-conductive structure, which includes a polymer and is connected to the outer structure and the inner structure, and the outer structure and the inner structure can be electrically connected at position overlapping with an opening formed in the non-conductive structure. Various other embodiments are possible.</description><language>eng ; fre ; ger</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230816&DB=EPODOC&CC=EP&NR=4228228A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230816&DB=EPODOC&CC=EP&NR=4228228A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Gidae</creatorcontrib><creatorcontrib>BAEK, Moohyun</creatorcontrib><title>ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD</title><description>An electronic device according to one embodiment of the present document comprises: a housing including the front surface of the electronic device, the rear surface of the electronic device, and side surfaces surrounding at least a part of the space between the front surface and the rear surface; and a display which is positioned in the space, and of which at least a part is visible through the front surface, wherein the housing comprises an outer structure, which includes a first metal material and forms at least a part of the side surfaces, an inner structure, which includes a second metal material different from the first metal material and is positioned in the space, and a non-conductive structure, which includes a polymer and is connected to the outer structure and the inner structure, and the outer structure and the inner structure can be electrically connected at position overlapping with an opening formed in the non-conductive structure. Various other embodiments are possible.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB19XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNX8PAPDQbSOgqOfi4wjoKvo1-om6NzSGgQmOca4uHvwsPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIyMLIDI0dCYCCUAMRgrrw</recordid><startdate>20230816</startdate><enddate>20230816</enddate><creator>KIM, Gidae</creator><creator>BAEK, Moohyun</creator><scope>EVB</scope></search><sort><creationdate>20230816</creationdate><title>ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD</title><author>KIM, Gidae ; BAEK, Moohyun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4228228A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Gidae</creatorcontrib><creatorcontrib>BAEK, Moohyun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Gidae</au><au>BAEK, Moohyun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD</title><date>2023-08-16</date><risdate>2023</risdate><abstract>An electronic device according to one embodiment of the present document comprises: a housing including the front surface of the electronic device, the rear surface of the electronic device, and side surfaces surrounding at least a part of the space between the front surface and the rear surface; and a display which is positioned in the space, and of which at least a part is visible through the front surface, wherein the housing comprises an outer structure, which includes a first metal material and forms at least a part of the side surfaces, an inner structure, which includes a second metal material different from the first metal material and is positioned in the space, and a non-conductive structure, which includes a polymer and is connected to the outer structure and the inner structure, and the outer structure and the inner structure can be electrically connected at position overlapping with an opening formed in the non-conductive structure. Various other embodiments are possible.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE INCLUDING HOUSING, AND HOUSING MANUFACTURING METHOD |
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