FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of se...

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Bibliographische Detailangaben
Hauptverfasser: HATTENDORF, Michael, AUTH, Christopher, WARD, Curtis, MEYER, Heidi
Format: Patent
Sprache:eng ; fre ; ger
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