CURABLE COMPOSITION, INK FOR SOLDER RESIST, AND PRINTED CIRCUIT BOARD

The present invention addresses the problem of providing: a curable composition from which a cured product having excellent adhesiveness and heat resistance and a low relative dielectric constant is formed; an ink for solder resist; and a printed circuit board using the same. A curable composition a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKABAYASHI, Toshiyuki, NAKAHARA, Issei, KATSUDA, Ai
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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