CURABLE COMPOSITION, INK FOR SOLDER RESIST, AND PRINTED CIRCUIT BOARD
The present invention addresses the problem of providing: a curable composition from which a cured product having excellent adhesiveness and heat resistance and a low relative dielectric constant is formed; an ink for solder resist; and a printed circuit board using the same. A curable composition a...
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| creator | TAKABAYASHI, Toshiyuki NAKAHARA, Issei KATSUDA, Ai |
| description | The present invention addresses the problem of providing: a curable composition from which a cured product having excellent adhesiveness and heat resistance and a low relative dielectric constant is formed; an ink for solder resist; and a printed circuit board using the same. A curable composition according to the present invention contains a (meth)acrylic monomer as a main component and further contains a photopolymerization initiator, a thermosetting compound, and a gelling agent, the curable composition being characterized in that a cured product of said curable composition has a relative dielectric constant of less than 2.90 at 10 GHz. |
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A curable composition according to the present invention contains a (meth)acrylic monomer as a main component and further contains a photopolymerization initiator, a thermosetting compound, and a gelling agent, the curable composition being characterized in that a cured product of said curable composition has a relative dielectric constant of less than 2.90 at 10 GHz.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230726&DB=EPODOC&CC=EP&NR=4215551A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230726&DB=EPODOC&CC=EP&NR=4215551A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKABAYASHI, Toshiyuki</creatorcontrib><creatorcontrib>NAKAHARA, Issei</creatorcontrib><creatorcontrib>KATSUDA, Ai</creatorcontrib><title>CURABLE COMPOSITION, INK FOR SOLDER RESIST, AND PRINTED CIRCUIT BOARD</title><description>The present invention addresses the problem of providing: a curable composition from which a cured product having excellent adhesiveness and heat resistance and a low relative dielectric constant is formed; an ink for solder resist; and a printed circuit board using the same. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | CURABLE COMPOSITION, INK FOR SOLDER RESIST, AND PRINTED CIRCUIT BOARD |
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