METHOD FOR DIVIDING COMPOSITE MATERIAL AND COMPOSITE MATERIAL
There is provided a method and the like capable of dividing a composite material without making cracks appear on end faces of its brittle material layer subjected to the division and without making end faces of its resin layer subjected to the division suffer serious thermal degradation and capable...
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| creator | KANNO, Toshihiro NAKAI, Kota INAGAKI, Junichi MURASHIGE, Takeshi HIRATA, Satoshi |
| description | There is provided a method and the like capable of dividing a composite material without making cracks appear on end faces of its brittle material layer subjected to the division and without making end faces of its resin layer subjected to the division suffer serious thermal degradation and capable of providing the composite material subjected to the division with a sufficient bending strength. The present invention provides a method for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. The processed marks formed in the brittle material removing step open on the resin layer side and do not penetrate through the brittle material layer. |
| format | Patent |
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The present invention provides a method for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. The processed marks formed in the brittle material removing step open on the resin layer side and do not penetrate through the brittle material layer.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=EP&NR=4209302A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=EP&NR=4209302A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANNO, Toshihiro</creatorcontrib><creatorcontrib>NAKAI, Kota</creatorcontrib><creatorcontrib>INAGAKI, Junichi</creatorcontrib><creatorcontrib>MURASHIGE, Takeshi</creatorcontrib><creatorcontrib>HIRATA, Satoshi</creatorcontrib><title>METHOD FOR DIVIDING COMPOSITE MATERIAL AND COMPOSITE MATERIAL</title><description>There is provided a method and the like capable of dividing a composite material without making cracks appear on end faces of its brittle material layer subjected to the division and without making end faces of its resin layer subjected to the division suffer serious thermal degradation and capable of providing the composite material subjected to the division with a sufficient bending strength. The present invention provides a method for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. 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The present invention provides a method for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. The processed marks formed in the brittle material removing step open on the resin layer side and do not penetrate through the brittle material layer.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR DIVIDING COMPOSITE MATERIAL AND COMPOSITE MATERIAL |
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