DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF

The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kim, Seunghwan, Kim, Sangbeom, Moon, Honggi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kim, Seunghwan
Kim, Sangbeom
Moon, Honggi
description The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4202084A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4202084A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4202084A23</originalsourceid><addsrcrecordid>eNrjZPBw8Q918nFV8HGMdA1ydVFw9XF1Dgny94kM8XRWcPYPCHANUnDz9_RRcPRzUfB19At1c3QOCQ3y9HNX8HUN8fB3UQjxAGr0d-NhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASZGBkYGFiaORsZEKAEAuHAsfQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>Kim, Seunghwan ; Kim, Sangbeom ; Moon, Honggi</creator><creatorcontrib>Kim, Seunghwan ; Kim, Sangbeom ; Moon, Honggi</creatorcontrib><description>The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230628&amp;DB=EPODOC&amp;CC=EP&amp;NR=4202084A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230628&amp;DB=EPODOC&amp;CC=EP&amp;NR=4202084A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Seunghwan</creatorcontrib><creatorcontrib>Kim, Sangbeom</creatorcontrib><creatorcontrib>Moon, Honggi</creatorcontrib><title>DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF</title><description>The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBw8Q918nFV8HGMdA1ydVFw9XF1Dgny94kM8XRWcPYPCHANUnDz9_RRcPRzUfB19At1c3QOCQ3y9HNX8HUN8fB3UQjxAGr0d-NhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASZGBkYGFiaORsZEKAEAuHAsfQ</recordid><startdate>20230628</startdate><enddate>20230628</enddate><creator>Kim, Seunghwan</creator><creator>Kim, Sangbeom</creator><creator>Moon, Honggi</creator><scope>EVB</scope></search><sort><creationdate>20230628</creationdate><title>DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF</title><author>Kim, Seunghwan ; Kim, Sangbeom ; Moon, Honggi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4202084A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Seunghwan</creatorcontrib><creatorcontrib>Kim, Sangbeom</creatorcontrib><creatorcontrib>Moon, Honggi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Seunghwan</au><au>Kim, Sangbeom</au><au>Moon, Honggi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF</title><date>2023-06-28</date><risdate>2023</risdate><abstract>The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4202084A2
source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T15%3A05%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Seunghwan&rft.date=2023-06-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4202084A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true