CAPACITOR AND POWER DEVICE ASSEMBLY HAVING COOLING STRUCTURE
A capacitor and power device assembly having a cooling structure is disclosed. The capacitor and power device assembly comprises an upper cover plate (1), a casing (2), a lower cover plate (3), a capacitor and power devices. The capacitor is disposed in a cavity of the casing (2), and the power devi...
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| creator | ZHANG, Hao LOPEZ, Gabriel Gallegos |
| description | A capacitor and power device assembly having a cooling structure is disclosed. The capacitor and power device assembly comprises an upper cover plate (1), a casing (2), a lower cover plate (3), a capacitor and power devices. The capacitor is disposed in a cavity of the casing (2), and the power devices are respectively disposed on outer sides of the upper cover plate (1) and the lower cover plate (3). The cooling structure comprises a first liquid inlet (4) and a first liquid outlet (5) that are disposed on the upper cover plate (1) and/or the lower cover plate (3) respectively. The cooling structure further comprises a first cooling passage and a second cooling passage that are respectively disposed on upper and lower sides of each of the upper cover plate (1) and the lower cover plate (3), the first cooling passage is configured to cool the capacitor, and the second cooling passage is configured to cool the power devices. The cooling structure adopts the liquid cooling mode. By providing the first cooling passage on both sides of the capacitor, the double side cooling of the capacitor is realized, and the cooling efficiency is high. Moreover, the cooling structure is also provided with a second cooling passage for cooling the power devices, so that the capacitor and power devices can be cooled simultaneously, the space occupied is small, and the structure is compact. |
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The capacitor and power device assembly comprises an upper cover plate (1), a casing (2), a lower cover plate (3), a capacitor and power devices. The capacitor is disposed in a cavity of the casing (2), and the power devices are respectively disposed on outer sides of the upper cover plate (1) and the lower cover plate (3). The cooling structure comprises a first liquid inlet (4) and a first liquid outlet (5) that are disposed on the upper cover plate (1) and/or the lower cover plate (3) respectively. The cooling structure further comprises a first cooling passage and a second cooling passage that are respectively disposed on upper and lower sides of each of the upper cover plate (1) and the lower cover plate (3), the first cooling passage is configured to cool the capacitor, and the second cooling passage is configured to cool the power devices. The cooling structure adopts the liquid cooling mode. By providing the first cooling passage on both sides of the capacitor, the double side cooling of the capacitor is realized, and the cooling efficiency is high. Moreover, the cooling structure is also provided with a second cooling passage for cooling the power devices, so that the capacitor and power devices can be cooled simultaneously, the space occupied is small, and the structure is compact.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240710&DB=EPODOC&CC=EP&NR=4199671A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240710&DB=EPODOC&CC=EP&NR=4199671A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG, Hao</creatorcontrib><creatorcontrib>LOPEZ, Gabriel Gallegos</creatorcontrib><title>CAPACITOR AND POWER DEVICE ASSEMBLY HAVING COOLING STRUCTURE</title><description>A capacitor and power device assembly having a cooling structure is disclosed. The capacitor and power device assembly comprises an upper cover plate (1), a casing (2), a lower cover plate (3), a capacitor and power devices. The capacitor is disposed in a cavity of the casing (2), and the power devices are respectively disposed on outer sides of the upper cover plate (1) and the lower cover plate (3). The cooling structure comprises a first liquid inlet (4) and a first liquid outlet (5) that are disposed on the upper cover plate (1) and/or the lower cover plate (3) respectively. The cooling structure further comprises a first cooling passage and a second cooling passage that are respectively disposed on upper and lower sides of each of the upper cover plate (1) and the lower cover plate (3), the first cooling passage is configured to cool the capacitor, and the second cooling passage is configured to cool the power devices. The cooling structure adopts the liquid cooling mode. By providing the first cooling passage on both sides of the capacitor, the double side cooling of the capacitor is realized, and the cooling efficiency is high. Moreover, the cooling structure is also provided with a second cooling passage for cooling the power devices, so that the capacitor and power devices can be cooled simultaneously, the space occupied is small, and the structure is compact.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxdgxwdPYM8Q9ScPRzUQjwD3cNUnBxDfN0dlVwDA529XXyiVTwcAzz9HNXcPb39wHRwSFBoc4hoUGuPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7Uk3jXAxNDS0szc0NHEmAglALnYKVo</recordid><startdate>20240710</startdate><enddate>20240710</enddate><creator>ZHANG, Hao</creator><creator>LOPEZ, Gabriel Gallegos</creator><scope>EVB</scope></search><sort><creationdate>20240710</creationdate><title>CAPACITOR AND POWER DEVICE ASSEMBLY HAVING COOLING STRUCTURE</title><author>ZHANG, Hao ; LOPEZ, Gabriel Gallegos</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4199671A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG, Hao</creatorcontrib><creatorcontrib>LOPEZ, Gabriel Gallegos</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG, Hao</au><au>LOPEZ, Gabriel Gallegos</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CAPACITOR AND POWER DEVICE ASSEMBLY HAVING COOLING STRUCTURE</title><date>2024-07-10</date><risdate>2024</risdate><abstract>A capacitor and power device assembly having a cooling structure is disclosed. The capacitor and power device assembly comprises an upper cover plate (1), a casing (2), a lower cover plate (3), a capacitor and power devices. The capacitor is disposed in a cavity of the casing (2), and the power devices are respectively disposed on outer sides of the upper cover plate (1) and the lower cover plate (3). The cooling structure comprises a first liquid inlet (4) and a first liquid outlet (5) that are disposed on the upper cover plate (1) and/or the lower cover plate (3) respectively. The cooling structure further comprises a first cooling passage and a second cooling passage that are respectively disposed on upper and lower sides of each of the upper cover plate (1) and the lower cover plate (3), the first cooling passage is configured to cool the capacitor, and the second cooling passage is configured to cool the power devices. The cooling structure adopts the liquid cooling mode. By providing the first cooling passage on both sides of the capacitor, the double side cooling of the capacitor is realized, and the cooling efficiency is high. Moreover, the cooling structure is also provided with a second cooling passage for cooling the power devices, so that the capacitor and power devices can be cooled simultaneously, the space occupied is small, and the structure is compact.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | CAPACITOR AND POWER DEVICE ASSEMBLY HAVING COOLING STRUCTURE |
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