FLUX AND SOLDER PASTE

A flux containing 0.1 to 20 wt% of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt% of a cationic surfactant and 5 to 60 wt% of a nonionic surfactant. A solder paste contains this flux and a metal powder.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMADA, Yo, YAMAGAME, Tomohiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!