WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER

A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHU, Schubert S, MORADIAN, Ala, PANDEY, Vishwas Kumar, KUMAR, Surajit, BURROWS, Brian Hayes, LAU, Shu-Kwan, TANNOUS, Adel George, RANGAPPA, Srinivasa, SHAH, Kartik Bhupendra, MYO, Nyi O, ZHU, Zuoming
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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