WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER
A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and...
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| creator | CHU, Schubert S MORADIAN, Ala PANDEY, Vishwas Kumar KUMAR, Surajit BURROWS, Brian Hayes LAU, Shu-Kwan TANNOUS, Adel George RANGAPPA, Srinivasa SHAH, Kartik Bhupendra MYO, Nyi O ZHU, Zuoming |
| description | A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and a bottom plate attached to an inner surface of the inner liner, the top plate and the bottom plate forming an enclosure together with the inner liner, a cassette disposed within the enclosure, the cassette comprising a plurality of shelves configured to retain a plurality of substrates thereon, and an edge temperature correcting element disposed between the inner liner and the first ring reflector. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER |
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