ELECTROLYTE AND DEPOSITION OF A COPPER BARRIER LAYER IN A DAMASCENE PROCESS

The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the copper. A thin barrier layer is formed by annealing the deposit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BLONDEAU, Paul, CAILLARD, Louis
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the copper. A thin barrier layer is formed by annealing the deposited copper alloy, which causes manganese or zinc to migrate to the interface between the insulating dielectric material and the copper.