VERTICAL DIODES EXTENDING THROUGH SUPPORT STRUCTURES
Disclosed herein are IC devices, packages, and device assemblies that include diodes arranged so that their first and second terminals may be contacted from the opposite faces of a support structure. Such diodes are referred to herein as "vertical diodes" to reflect the fact that the diode...
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creator | PANAGOPOULOS, Georgios GEIGER, Richard RAUH, Johannes Xaver GOSSNER, Harald |
description | Disclosed herein are IC devices, packages, and device assemblies that include diodes arranged so that their first and second terminals may be contacted from the opposite faces of a support structure. Such diodes are referred to herein as "vertical diodes" to reflect the fact that the diode extends, in a vertical direction (i.e., in a direction perpendicular to the support structure), between the bottom and the top of support structures. Vertical diodes as described herein may introduce additional degrees of freedom in diode choices in terms of, e.g., high-voltage handling, capacitance modulation, and speed. |
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Vertical diodes as described herein may introduce additional degrees of freedom in diode choices in terms of, e.g., high-voltage handling, capacitance modulation, and speed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJcw0K8XR29FFw8fR3cQ1WcI0IcfVz8fRzVwjxCPIPdfdQCA4NCPAPClEIDgkKdQ4JDXIN5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJoYWJqbmFo6GxkQoAQC4tSen</recordid><startdate>20230524</startdate><enddate>20230524</enddate><creator>PANAGOPOULOS, Georgios</creator><creator>GEIGER, Richard</creator><creator>RAUH, Johannes Xaver</creator><creator>GOSSNER, Harald</creator><scope>EVB</scope></search><sort><creationdate>20230524</creationdate><title>VERTICAL DIODES EXTENDING THROUGH SUPPORT STRUCTURES</title><author>PANAGOPOULOS, Georgios ; GEIGER, Richard ; RAUH, Johannes Xaver ; GOSSNER, Harald</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4184578A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PANAGOPOULOS, Georgios</creatorcontrib><creatorcontrib>GEIGER, Richard</creatorcontrib><creatorcontrib>RAUH, Johannes Xaver</creatorcontrib><creatorcontrib>GOSSNER, Harald</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PANAGOPOULOS, Georgios</au><au>GEIGER, Richard</au><au>RAUH, Johannes Xaver</au><au>GOSSNER, Harald</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VERTICAL DIODES EXTENDING THROUGH SUPPORT STRUCTURES</title><date>2023-05-24</date><risdate>2023</risdate><abstract>Disclosed herein are IC devices, packages, and device assemblies that include diodes arranged so that their first and second terminals may be contacted from the opposite faces of a support structure. 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subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION SEMICONDUCTOR DEVICES |
title | VERTICAL DIODES EXTENDING THROUGH SUPPORT STRUCTURES |
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