MEMS CHIP AND PREPARATION METHOD THEREFOR, MEMS DEVICE AND ELECTRONIC DEVICE

MEMS CHIP AND PREPARATION METHOD THEREFOR, MEMS DEVICE AND ELECTRONIC DEVICE

An MEMS chip is disclosed, including a substrate (10), a movable assembly (20), a fastening assembly (30), and a drive assembly (60). The fastening assembly (30) is located between the substrate (10) and the movable assembly (20). The movable assembly (20) includes a fastening portion (21), a movabl...

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Hauptverfasser: SUN, Fengpei, XU, Jinghui, DONG, Xiaoshi, FENG, Zhihong
Format: Patent
Sprache:eng ; fre ; ger
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MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
TRANSPORTING
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creator SUN, Fengpei
XU, Jinghui
DONG, Xiaoshi
FENG, Zhihong
description An MEMS chip is disclosed, including a substrate (10), a movable assembly (20), a fastening assembly (30), and a drive assembly (60). The fastening assembly (30) is located between the substrate (10) and the movable assembly (20). The movable assembly (20) includes a fastening portion (21), a movable portion (22), and a first support beam (23). The first support beam (23) is connected to the movable portion (22) and the fastening portion (21). A first avoidance slot (24) is disposed on a face that is of the movable portion (22) and that faces the fastening assembly (30). The fastening assembly (30) is grounded. Aboss (31) and a first position limiting pole (32) are disposed on a face that is of the fastening assembly (30) and that faces the movable assembly. The boss (31) is connected to the fastening portion (21) and is configured to support the fastening portion (21). The first position limiting pole (32) corresponds to the first avoidance slot (24). The drive assembly (60) is connected to the movable portion (22) to drive the movable portion (22) to move. The first position limiting pole of the MEMS chip has a stop function, to improve structural reliability of the chip. An MEMS chip array, an MEMS device, an electronic device, and an MEMS chip manufacturing method are further disclosed.
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language eng ; fre ; ger
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subjects MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
TRANSPORTING
title MEMS CHIP AND PREPARATION METHOD THEREFOR, MEMS DEVICE AND ELECTRONIC DEVICE
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