ELECTRONIC ASSEMBLY AND ELECTRONIC SYSTEM WITH IMPEDANCE MATCHED INTERCONNECT STRUCTURES

Provided is an electronic assembly (120) comprising (a) an interconnect carrier (130) comprising an electrically insulating core (132) and at least two electrically conducting layers (134) formed at the electrically insulating core (132); (b) a first integrated circuit chip (122) mounted at a first side (130a) of the interconnect carrier (130); (c) a second integrated circuit chip (124) mounted at a second side (130b) of the interconnect carrier (130), wherein the second side (130b) is opposite to the first side (130a); and (d) an interconnection structure (140) electrically connecting the first integrated circuit chip (122) with the second integrated circuit chip (124). The electric interconnection structure (140) extends around the insulating core (132) and comprises at least one electric conductor path (150) which is designed in such a manner that an impedance match between the first integrated circuit chip (122) and the second integrated circuit chip (124) is provided. Further, there is provided an electronic system (300, 400, 600) comprising such an electronic assembly (120).