DIAMOND COMPOSITE AND PRODUCTION METHOD THEREFOR

DIAMOND COMPOSITE AND PRODUCTION METHOD THEREFOR

This diamond composite (100) includes a first base substrate (10) which has an oxide layer (10a) of element M and contains the element M in the composition and a second base substrate (20) which is bonded to the oxide layer (10a) and is composed of diamond, in which the M is one or more selected fro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MATSUMAE, Takashi, KURASHIMA, Yuuichi, TAKAGI, Hideki, UMEZAWA, Hitoshi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This diamond composite (100) includes a first base substrate (10) which has an oxide layer (10a) of element M and contains the element M in the composition and a second base substrate (20) which is bonded to the oxide layer (10a) and is composed of diamond, in which the M is one or more selected from a metal element (where alkali metals and alkaline earth metals are excluded) with which an oxide can be formed, Si, Ge, As, Se, Sb, Te, and Bi, and the second base substrate (20) is bonded to the oxide layer (10a) of the first base substrate (10) by M-O-C bonding of at least some C atoms on the (100) surface of the diamond constituting the second base substrate (20).