RESIN ENCAPSULATED SEMICONDUCTOR PACKAGE COMPRISING AN EXTERNAL RECESS WITH EXPOSED ELECTRICAL CONTACTS AND A SEMICONDUCTOR MODULE USING THE SAME

A semiconductor package (10; 20) comprising a substrate (11), at least one semiconductor die (12) disposed on the substrate (11), at least one electrical connector (13) connected with the semiconductor die (12), an encapsulant (14) covering the substrate (11), the at least one semiconductor die (12)...

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Hauptverfasser:	NIKITIN, Ivan, SCHMOELZER, Bernd, TREU, Julian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	NIKITIN, Ivan SCHMOELZER, Bernd TREU, Julian
description	A semiconductor package (10; 20) comprising a substrate (11), at least one semiconductor die (12) disposed on the substrate (11), at least one electrical connector (13) connected with the semiconductor die (12), an encapsulant (14) covering the substrate (11), the at least one semiconductor die (12), and at least partially the electrical connector (13), the encapsulant (14) comprising a recess (14A) formed into a main surface of the encapsulant (14), wherein the at least one electrical connector (13) is exposed within the recess (14A).
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	RESIN ENCAPSULATED SEMICONDUCTOR PACKAGE COMPRISING AN EXTERNAL RECESS WITH EXPOSED ELECTRICAL CONTACTS AND A SEMICONDUCTOR MODULE USING THE SAME
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