RESIN ENCAPSULATED SEMICONDUCTOR PACKAGE COMPRISING AN EXTERNAL RECESS WITH EXPOSED ELECTRICAL CONTACTS AND A SEMICONDUCTOR MODULE USING THE SAME

RESIN ENCAPSULATED SEMICONDUCTOR PACKAGE COMPRISING AN EXTERNAL RECESS WITH EXPOSED ELECTRICAL CONTACTS AND A SEMICONDUCTOR MODULE USING THE SAME

A semiconductor package (10; 20) comprising a substrate (11), at least one semiconductor die (12) disposed on the substrate (11), at least one electrical connector (13) connected with the semiconductor die (12), an encapsulant (14) covering the substrate (11), the at least one semiconductor die (12)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NIKITIN, Ivan, SCHMOELZER, Bernd, TREU, Julian
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package (10; 20) comprising a substrate (11), at least one semiconductor die (12) disposed on the substrate (11), at least one electrical connector (13) connected with the semiconductor die (12), an encapsulant (14) covering the substrate (11), the at least one semiconductor die (12), and at least partially the electrical connector (13), the encapsulant (14) comprising a recess (14A) formed into a main surface of the encapsulant (14), wherein the at least one electrical connector (13) is exposed within the recess (14A).