TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS
Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In the illustrative embodiment, a lens assembly with one or more lenses is positioned to collimate light coming out of one or more waveguides in the PIC die. Part of the illustrative lens assembly extends abov...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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