POWER SEMICONDUCTOR MODULES

A power semiconductor module arrangement comprises at least one substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; a housing at least partly enclosi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BÖNIG, Guido, LUDWIG, Marco
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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