SEMICONDUCTOR DEVICE HAVING GALVANIC ISOLATION AND METHOD THEREFOR

A semiconductor device package having galvanic isolation is provided. The semiconductor device includes a package leadframe having a first die pad and a second die pad separated from the first die pad. A first semiconductor die is attached to the first die pad of the package leadframe. A second semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rudiak, Jerry, Carpenter, Burton Jesse, Brauchler, Fred T
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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