LED LIGHTING STRIP AND THE MANUFACTURING SYSTEM THEREOF
A light-emitting diode (LED) lighting strip (100) having partial potting and the manufacturing system (300) of the LED lighting strip (100) are provided. The LED lighting strip (100) has a flexible printed circuit board (FPCB) (122) with a plurality of LED modules (120) thereon. Each individual LED...
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| creator | LU, Yuan YANG, Canbang |
| description | A light-emitting diode (LED) lighting strip (100) having partial potting and the manufacturing system (300) of the LED lighting strip (100) are provided. The LED lighting strip (100) has a flexible printed circuit board (FPCB) (122) with a plurality of LED modules (120) thereon. Each individual LED module (120) comprises one or more LED chips (121). The LED lighting strip (100) is protected by an encapsulant (123) disposed above the LED chips (121). The system (300) includes an upper cover processing subsystem (301), a circuit board processing subsystem (302), and a baking oven (360). The upper cover processing subsystem (301) includes a first extrusion machine (310) for making the thermoplastic glue (130), a pit forming tool (320) to obtain an upper cover (123A), and an adhesive application tool (330). The pit forming tool (320) is configured to form slots (124A) on the bottom side of the thermoplastic glue (130), thereby the upper cover (123A) covers the FPCB (122) with air gaps (124) arranged above the LED chips (121) for improving a perceptual performance on chromaticity coordinates. |
| format | Patent |
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The LED lighting strip (100) has a flexible printed circuit board (FPCB) (122) with a plurality of LED modules (120) thereon. Each individual LED module (120) comprises one or more LED chips (121). The LED lighting strip (100) is protected by an encapsulant (123) disposed above the LED chips (121). The system (300) includes an upper cover processing subsystem (301), a circuit board processing subsystem (302), and a baking oven (360). The upper cover processing subsystem (301) includes a first extrusion machine (310) for making the thermoplastic glue (130), a pit forming tool (320) to obtain an upper cover (123A), and an adhesive application tool (330). The pit forming tool (320) is configured to form slots (124A) on the bottom side of the thermoplastic glue (130), thereby the upper cover (123A) covers the FPCB (122) with air gaps (124) arranged above the LED chips (121) for improving a perceptual performance on chromaticity coordinates.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; NON-PORTABLE LIGHTING DEVICES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; SYSTEMS THEREOF ; TRANSPORTING ; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS ; WEAPONS ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230614&DB=EPODOC&CC=EP&NR=4139969A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230614&DB=EPODOC&CC=EP&NR=4139969A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU, Yuan</creatorcontrib><creatorcontrib>YANG, Canbang</creatorcontrib><title>LED LIGHTING STRIP AND THE MANUFACTURING SYSTEM THEREOF</title><description>A light-emitting diode (LED) lighting strip (100) having partial potting and the manufacturing system (300) of the LED lighting strip (100) are provided. The LED lighting strip (100) has a flexible printed circuit board (FPCB) (122) with a plurality of LED modules (120) thereon. Each individual LED module (120) comprises one or more LED chips (121). The LED lighting strip (100) is protected by an encapsulant (123) disposed above the LED chips (121). The system (300) includes an upper cover processing subsystem (301), a circuit board processing subsystem (302), and a baking oven (360). The upper cover processing subsystem (301) includes a first extrusion machine (310) for making the thermoplastic glue (130), a pit forming tool (320) to obtain an upper cover (123A), and an adhesive application tool (330). The pit forming tool (320) is configured to form slots (124A) on the bottom side of the thermoplastic glue (130), thereby the upper cover (123A) covers the FPCB (122) with air gaps (124) arranged above the LED chips (121) for improving a perceptual performance on chromaticity coordinates.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-PORTABLE LIGHTING DEVICES</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>SYSTEMS THEREOF</subject><subject>TRANSPORTING</subject><subject>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</subject><subject>WEAPONS</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD3cXVR8PF09wjx9HNXCA4J8gxQcPRzUQjxcFXwdfQLdXN0DgkNAstFBoe4-oIkglz93XgYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgImhsaWlmaWjiTERSgDu7Sf1</recordid><startdate>20230614</startdate><enddate>20230614</enddate><creator>LU, Yuan</creator><creator>YANG, Canbang</creator><scope>EVB</scope></search><sort><creationdate>20230614</creationdate><title>LED LIGHTING STRIP AND THE MANUFACTURING SYSTEM THEREOF</title><author>LU, Yuan ; YANG, Canbang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4139969A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-PORTABLE LIGHTING DEVICES</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>SYSTEMS THEREOF</topic><topic>TRANSPORTING</topic><topic>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</topic><topic>WEAPONS</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>LU, Yuan</creatorcontrib><creatorcontrib>YANG, Canbang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU, Yuan</au><au>YANG, Canbang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED LIGHTING STRIP AND THE MANUFACTURING SYSTEM THEREOF</title><date>2023-06-14</date><risdate>2023</risdate><abstract>A light-emitting diode (LED) lighting strip (100) having partial potting and the manufacturing system (300) of the LED lighting strip (100) are provided. The LED lighting strip (100) has a flexible printed circuit board (FPCB) (122) with a plurality of LED modules (120) thereon. Each individual LED module (120) comprises one or more LED chips (121). The LED lighting strip (100) is protected by an encapsulant (123) disposed above the LED chips (121). The system (300) includes an upper cover processing subsystem (301), a circuit board processing subsystem (302), and a baking oven (360). The upper cover processing subsystem (301) includes a first extrusion machine (310) for making the thermoplastic glue (130), a pit forming tool (320) to obtain an upper cover (123A), and an adhesive application tool (330). The pit forming tool (320) is configured to form slots (124A) on the bottom side of the thermoplastic glue (130), thereby the upper cover (123A) covers the FPCB (122) with air gaps (124) arranged above the LED chips (121) for improving a perceptual performance on chromaticity coordinates.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF TRANSPORTING VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | LED LIGHTING STRIP AND THE MANUFACTURING SYSTEM THEREOF |
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