PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

A stacked device including a first substrate that includes a quantum information processing device, a second substrate bonded to the first substrate, and multiple bump bonds and at least one pillar between the first substrate and the second substrate. Each bump bond of the multiple bump bonds provid...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LUCERO, Erik Anthony
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRICITY PHYSICS
Online-Zugang:	Volltext bestellen
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