ELECTRONIC CIRCUIT
The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one...
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creator | RAGONNEAU, Marc BELNOUE, Olivier VINCENT, Jacques ROLLIN, Pascal DUFFAUD, Bertrand |
description | The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4). |
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fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230208&DB=EPODOC&CC=EP&NR=4129021A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230208&DB=EPODOC&CC=EP&NR=4129021A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAGONNEAU, Marc</creatorcontrib><creatorcontrib>BELNOUE, Olivier</creatorcontrib><creatorcontrib>VINCENT, Jacques</creatorcontrib><creatorcontrib>ROLLIN, Pascal</creatorcontrib><creatorcontrib>DUFFAUD, Bertrand</creatorcontrib><title>ELECTRONIC CIRCUIT</title><description>The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBy9XF1Dgny9_N0VnD2DHIO9QzhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmhkaWBkaGjobGRCgBAAcBHaI</recordid><startdate>20230208</startdate><enddate>20230208</enddate><creator>RAGONNEAU, Marc</creator><creator>BELNOUE, Olivier</creator><creator>VINCENT, Jacques</creator><creator>ROLLIN, Pascal</creator><creator>DUFFAUD, Bertrand</creator><scope>EVB</scope></search><sort><creationdate>20230208</creationdate><title>ELECTRONIC CIRCUIT</title><author>RAGONNEAU, Marc ; BELNOUE, Olivier ; VINCENT, Jacques ; ROLLIN, Pascal ; DUFFAUD, Bertrand</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4129021A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>RAGONNEAU, Marc</creatorcontrib><creatorcontrib>BELNOUE, Olivier</creatorcontrib><creatorcontrib>VINCENT, Jacques</creatorcontrib><creatorcontrib>ROLLIN, Pascal</creatorcontrib><creatorcontrib>DUFFAUD, Bertrand</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAGONNEAU, Marc</au><au>BELNOUE, Olivier</au><au>VINCENT, Jacques</au><au>ROLLIN, Pascal</au><au>DUFFAUD, Bertrand</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC CIRCUIT</title><date>2023-02-08</date><risdate>2023</risdate><abstract>The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | ELECTRONIC CIRCUIT |
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