ELECTRONIC MODULE FOR CHIP CARD
The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (...
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creator | CARRIER, Cécile FABRIZIO, Kevin DI BERNARDO, Maxime |
description | The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15). The electronic module (30) comprises at least one stay-in-place safety layer (31) arranged between the first carrier layer (10) and the substrate (12), the safety layer (31) being an adhesive layer, the safety layer (31) having technical features such that the binding forces Fad1 of the layer are lower than the binding forces Fad2 of the holding means (4) so as to cause the rupture of the feeder links (15) by the action of a tensile force exerted on the electronic module. |
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The electronic module (30) comprises at least one stay-in-place safety layer (31) arranged between the first carrier layer (10) and the substrate (12), the safety layer (31) being an adhesive layer, the safety layer (31) having technical features such that the binding forces Fad1 of the layer are lower than the binding forces Fad2 of the holding means (4) so as to cause the rupture of the feeder links (15) by the action of a tensile force exerted on the electronic module.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB39XF1Dgny9_N0VvD1dwn1cVVw8w9ScPbwDFBwdgxy4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJoZGFsbGlo6GxkQoAQB9LyD9</recordid><startdate>20230208</startdate><enddate>20230208</enddate><creator>CARRIER, Cécile</creator><creator>FABRIZIO, Kevin</creator><creator>DI BERNARDO, Maxime</creator><scope>EVB</scope></search><sort><creationdate>20230208</creationdate><title>ELECTRONIC MODULE FOR CHIP CARD</title><author>CARRIER, Cécile ; FABRIZIO, Kevin ; DI BERNARDO, Maxime</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4128339A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CARRIER, Cécile</creatorcontrib><creatorcontrib>FABRIZIO, Kevin</creatorcontrib><creatorcontrib>DI BERNARDO, Maxime</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CARRIER, Cécile</au><au>FABRIZIO, Kevin</au><au>DI BERNARDO, Maxime</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC MODULE FOR CHIP CARD</title><date>2023-02-08</date><risdate>2023</risdate><abstract>The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15). The electronic module (30) comprises at least one stay-in-place safety layer (31) arranged between the first carrier layer (10) and the substrate (12), the safety layer (31) being an adhesive layer, the safety layer (31) having technical features such that the binding forces Fad1 of the layer are lower than the binding forces Fad2 of the holding means (4) so as to cause the rupture of the feeder links (15) by the action of a tensile force exerted on the electronic module.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP4128339A1 |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | ELECTRONIC MODULE FOR CHIP CARD |
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