SENSOR PACKAGE, METHOD FOR MANUFACTURING SAME, AND IMAGING DEVICE
The present disclosure relates to a sensor package, a method of manufacturing the same, and an imaging device that can achieve downsizing and height reduction and suppress occurrence of a flare.A sensor package includes: a solid-state imaging element that generates a pixel signal by photoelectric co...
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| creator | DOBASHI Eiichiro |
| description | The present disclosure relates to a sensor package, a method of manufacturing the same, and an imaging device that can achieve downsizing and height reduction and suppress occurrence of a flare.A sensor package includes: a solid-state imaging element that generates a pixel signal by photoelectric conversion in accordance with a light amount of incident light; a circuit board electrically connected to the solid-state imaging element; a sensor package substrate that is arranged on an incident light side of the solid-state imaging element and brings the solid-state imaging element into a sealed state; and a lens formed on a lower surface of the sensor package substrate, the lower surface being located on a side of the solid-state imaging element. The present disclosure can be applied to, for example, the imaging device or the like. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY ELECTROGRAPHY HOLOGRAPHY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION |
| title | SENSOR PACKAGE, METHOD FOR MANUFACTURING SAME, AND IMAGING DEVICE |
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