EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES

An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SINGH, Navneet Kumar, KANIVIHALLI, Raghavendra S, PIOUS, Aiswarya M, RAO, Samantha, ALVA, Samarth, SINGH, Bijendra
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SINGH, Navneet Kumar
KANIVIHALLI, Raghavendra S
PIOUS, Aiswarya M
RAO, Samantha
ALVA, Samarth
SINGH, Bijendra
description An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4123420B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4123420B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4123420B13</originalsourceid><addsrcrecordid>eNrjZDBzjQhxDfJz9FFw9vf38fRzVwj29wkN8fT3U3DzD1Lw9Xfy9HEFyvkGAAWBsi6uYZ7OrsE8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDE0MjYxMjAydCYCCUA4S8nqg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES</title><source>esp@cenet</source><creator>SINGH, Navneet Kumar ; KANIVIHALLI, Raghavendra S ; PIOUS, Aiswarya M ; RAO, Samantha ; ALVA, Samarth ; SINGH, Bijendra</creator><creatorcontrib>SINGH, Navneet Kumar ; KANIVIHALLI, Raghavendra S ; PIOUS, Aiswarya M ; RAO, Samantha ; ALVA, Samarth ; SINGH, Bijendra</creatorcontrib><description>An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CALCULATING ; COMPUTING ; CONDUCTORS ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; INSULATORS ; PHYSICS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240918&amp;DB=EPODOC&amp;CC=EP&amp;NR=4123420B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240918&amp;DB=EPODOC&amp;CC=EP&amp;NR=4123420B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SINGH, Navneet Kumar</creatorcontrib><creatorcontrib>KANIVIHALLI, Raghavendra S</creatorcontrib><creatorcontrib>PIOUS, Aiswarya M</creatorcontrib><creatorcontrib>RAO, Samantha</creatorcontrib><creatorcontrib>ALVA, Samarth</creatorcontrib><creatorcontrib>SINGH, Bijendra</creatorcontrib><title>EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES</title><description>An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>CONDUCTORS</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>PHYSICS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBzjQhxDfJz9FFw9vf38fRzVwj29wkN8fT3U3DzD1Lw9Xfy9HEFyvkGAAWBsi6uYZ7OrsE8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDE0MjYxMjAydCYCCUA4S8nqg</recordid><startdate>20240918</startdate><enddate>20240918</enddate><creator>SINGH, Navneet Kumar</creator><creator>KANIVIHALLI, Raghavendra S</creator><creator>PIOUS, Aiswarya M</creator><creator>RAO, Samantha</creator><creator>ALVA, Samarth</creator><creator>SINGH, Bijendra</creator><scope>EVB</scope></search><sort><creationdate>20240918</creationdate><title>EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES</title><author>SINGH, Navneet Kumar ; KANIVIHALLI, Raghavendra S ; PIOUS, Aiswarya M ; RAO, Samantha ; ALVA, Samarth ; SINGH, Bijendra</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4123420B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>CONDUCTORS</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>PHYSICS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>SINGH, Navneet Kumar</creatorcontrib><creatorcontrib>KANIVIHALLI, Raghavendra S</creatorcontrib><creatorcontrib>PIOUS, Aiswarya M</creatorcontrib><creatorcontrib>RAO, Samantha</creatorcontrib><creatorcontrib>ALVA, Samarth</creatorcontrib><creatorcontrib>SINGH, Bijendra</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SINGH, Navneet Kumar</au><au>KANIVIHALLI, Raghavendra S</au><au>PIOUS, Aiswarya M</au><au>RAO, Samantha</au><au>ALVA, Samarth</au><au>SINGH, Bijendra</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES</title><date>2024-09-18</date><risdate>2024</risdate><abstract>An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4123420B1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CABLES
CALCULATING
COMPUTING
CONDUCTORS
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
INSULATORS
PHYSICS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
title EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T14%3A53%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SINGH,%20Navneet%20Kumar&rft.date=2024-09-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4123420B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true