LASER LIFT-OFF PROCESSING SYSTEM INCLUDING METAL GRID

A method of manufacturing a light emitting diode (LED) device includes forming an LED structure by depositing a plurality of semiconductor layers on a transparent substrate. Trenched metal is placed in the plurality of semiconductor layers, with the trenched metal contacting the transparent substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HII, Khing-Lim, Saraswati, SCOTT, Dennis, WONG, Chee Chung James, MAH, Pei Chee
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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