LASER LIFT-OFF PROCESSING SYSTEM INCLUDING METAL GRID

LASER LIFT-OFF PROCESSING SYSTEM INCLUDING METAL GRID

A method of manufacturing a light emitting diode (LED) device includes forming an LED structure by depositing a plurality of semiconductor layers on a transparent substrate. Trenched metal is placed in the plurality of semiconductor layers, with the trenched metal contacting the transparent substrat...

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Hauptverfasser: HII, Khing-Lim, Saraswati, SCOTT, Dennis, WONG, Chee Chung James, MAH, Pei Chee
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HII, Khing-Lim
Saraswati
SCOTT, Dennis
WONG, Chee Chung James
MAH, Pei Chee
description A method of manufacturing a light emitting diode (LED) device includes forming an LED structure by depositing a plurality of semiconductor layers on a transparent substrate. Trenched metal is placed in the plurality of semiconductor layers, with the trenched metal contacting the transparent substrate. The LED structure is attached to a CMOS structure with electrical interconnects that define a cavity therebetween. Laser light is used to provide laser lift-off of the transparent substrate from the plurality of semiconductor layers.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LASER LIFT-OFF PROCESSING SYSTEM INCLUDING METAL GRID
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