HIGH BANDWIDTH MODULE

A module includes a substrate having a plurality of contact regions, and a spacer-chip assembly. The spacer-chip assembly in turn includes at least first and second semiconductor dies, each having a plurality of electrical interconnect pillars and a plurality of contact pads, and a spacer wafer. The...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUZZY, Chris, LI, Shidong, WASSICK, Thomas, Anthony, SINGH, Bhupender, ARVIN, Charles, Leon
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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