SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE

A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). The plurality of pho...

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Hauptverfasser: MURAKAWA, Yusuke, KITANO, Shin, TSUCHIMOTO, Koya, NAKAMURA, Makoto, NODA, Yuki, HANADA, Takuya
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creator MURAKAWA, Yusuke
KITANO, Shin
TSUCHIMOTO, Koya
NAKAMURA, Makoto
NODA, Yuki
HANADA, Takuya
description A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). The plurality of photoelectric conversion elements (311) is arranged side by side in a first region. The plurality of current-voltage conversion circuits (320) converts currents output from the plurality of photoelectric conversion elements (311) into voltages, respectively. The plurality of address event detection circuits (231) detects changes in voltages output from the plurality of current-voltage conversion circuits (320), respectively. The first ground wiring (424) is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements (311). The second ground wiring (421) is provided in the second region and supplies second ground potential having a voltage value different from that of the first ground potential to the plurality of current-voltage conversion circuits (320).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE
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