SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE
A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). The plurality of pho...
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creator | MURAKAWA, Yusuke KITANO, Shin TSUCHIMOTO, Koya NAKAMURA, Makoto NODA, Yuki HANADA, Takuya |
description | A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). The plurality of photoelectric conversion elements (311) is arranged side by side in a first region. The plurality of current-voltage conversion circuits (320) converts currents output from the plurality of photoelectric conversion elements (311) into voltages, respectively. The plurality of address event detection circuits (231) detects changes in voltages output from the plurality of current-voltage conversion circuits (320), respectively. The first ground wiring (424) is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements (311). The second ground wiring (421) is provided in the second region and supplies second ground potential having a voltage value different from that of the first ground potential to the plurality of current-voltage conversion circuits (320). |
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The plurality of photoelectric conversion elements (311) is arranged side by side in a first region. The plurality of current-voltage conversion circuits (320) converts currents output from the plurality of photoelectric conversion elements (311) into voltages, respectively. The plurality of address event detection circuits (231) detects changes in voltages output from the plurality of current-voltage conversion circuits (320), respectively. The first ground wiring (424) is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements (311). The second ground wiring (421) is provided in the second region and supplies second ground potential having a voltage value different from that of the first ground potential to the plurality of current-voltage conversion circuits (320).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230802&DB=EPODOC&CC=EP&NR=4106322A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230802&DB=EPODOC&CC=EP&NR=4106322A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURAKAWA, Yusuke</creatorcontrib><creatorcontrib>KITANO, Shin</creatorcontrib><creatorcontrib>TSUCHIMOTO, Koya</creatorcontrib><creatorcontrib>NAKAMURA, Makoto</creatorcontrib><creatorcontrib>NODA, Yuki</creatorcontrib><creatorcontrib>HANADA, Takuya</creatorcontrib><title>SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE</title><description>A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). 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The second ground wiring (421) is provided in the second region and supplies second ground potential having a voltage value different from that of the first ground potential to the plurality of current-voltage conversion circuits (320).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAN9vfxdNENDnEMcVXw9HV09_RzV3BxDfN0dlVw9HNBE-JhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASaGBmbGRkaOJsZEKAEAS2Ikmg</recordid><startdate>20230802</startdate><enddate>20230802</enddate><creator>MURAKAWA, Yusuke</creator><creator>KITANO, Shin</creator><creator>TSUCHIMOTO, Koya</creator><creator>NAKAMURA, Makoto</creator><creator>NODA, Yuki</creator><creator>HANADA, Takuya</creator><scope>EVB</scope></search><sort><creationdate>20230802</creationdate><title>SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE</title><author>MURAKAWA, Yusuke ; KITANO, Shin ; TSUCHIMOTO, Koya ; NAKAMURA, Makoto ; NODA, Yuki ; HANADA, Takuya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4106322A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MURAKAWA, Yusuke</creatorcontrib><creatorcontrib>KITANO, Shin</creatorcontrib><creatorcontrib>TSUCHIMOTO, Koya</creatorcontrib><creatorcontrib>NAKAMURA, Makoto</creatorcontrib><creatorcontrib>NODA, Yuki</creatorcontrib><creatorcontrib>HANADA, Takuya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURAKAWA, Yusuke</au><au>KITANO, Shin</au><au>TSUCHIMOTO, Koya</au><au>NAKAMURA, Makoto</au><au>NODA, Yuki</au><au>HANADA, Takuya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE</title><date>2023-08-02</date><risdate>2023</risdate><abstract>A solid-state imaging device (200) is provided with a plurality of photoelectric conversion elements (311), a plurality of current-voltage conversion circuits (320), a plurality of address event detection circuits (231), first ground wiring (424), and second ground wiring (421). The plurality of photoelectric conversion elements (311) is arranged side by side in a first region. The plurality of current-voltage conversion circuits (320) converts currents output from the plurality of photoelectric conversion elements (311) into voltages, respectively. The plurality of address event detection circuits (231) detects changes in voltages output from the plurality of current-voltage conversion circuits (320), respectively. The first ground wiring (424) is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements (311). The second ground wiring (421) is provided in the second region and supplies second ground potential having a voltage value different from that of the first ground potential to the plurality of current-voltage conversion circuits (320).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
title | SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE |
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