HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE

HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE

The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In additio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YANG, Guo, LIN, Shuainan, JIN, Linfang
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YANG, Guo
LIN, Shuainan
JIN, Linfang
description The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4099809A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4099809A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4099809A13</originalsourceid><addsrcrecordid>eNrjZHDzcHUMUXDxDA72DHAM8fT3UwgOCQp1DgkNclVw8w9ScPVxdQ4J8vfzdFZwcQ3zdHZVcPRzwRTlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmBpaWFgaWjobGRCgBAGZuLAc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>YANG, Guo ; LIN, Shuainan ; JIN, Linfang</creator><creatorcontrib>YANG, Guo ; LIN, Shuainan ; JIN, Linfang</creatorcontrib><description>The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221207&amp;DB=EPODOC&amp;CC=EP&amp;NR=4099809A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221207&amp;DB=EPODOC&amp;CC=EP&amp;NR=4099809A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG, Guo</creatorcontrib><creatorcontrib>LIN, Shuainan</creatorcontrib><creatorcontrib>JIN, Linfang</creatorcontrib><title>HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE</title><description>The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzcHUMUXDxDA72DHAM8fT3UwgOCQp1DgkNclVw8w9ScPVxdQ4J8vfzdFZwcQ3zdHZVcPRzwRTlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmBpaWFgaWjobGRCgBAGZuLAc</recordid><startdate>20221207</startdate><enddate>20221207</enddate><creator>YANG, Guo</creator><creator>LIN, Shuainan</creator><creator>JIN, Linfang</creator><scope>EVB</scope></search><sort><creationdate>20221207</creationdate><title>HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE</title><author>YANG, Guo ; LIN, Shuainan ; JIN, Linfang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4099809A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG, Guo</creatorcontrib><creatorcontrib>LIN, Shuainan</creatorcontrib><creatorcontrib>JIN, Linfang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG, Guo</au><au>LIN, Shuainan</au><au>JIN, Linfang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE</title><date>2022-12-07</date><risdate>2022</risdate><abstract>The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4099809A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T07%3A02%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG,%20Guo&rft.date=2022-12-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4099809A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true