METHOD FOR MANUFACTURING TEST PIECE FOR ADHESION EVALUATION TEST, AND ADHESION EVALUATION METHOD

METHOD FOR MANUFACTURING TEST PIECE FOR ADHESION EVALUATION TEST, AND ADHESION EVALUATION METHOD

A method for manufacturing a test piece for an adhesion evaluation test includes a process S 100 of preparing a semiconductor device and a process S200 of forming a test piece for an adhesion evaluation test. In the process S100 of preparing the semiconductor device, the semiconductor device include...

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Hauptverfasser: OMORI, Nobuhiko, IWAI, Takamasa, FUJINO, Junji
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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creator OMORI, Nobuhiko
IWAI, Takamasa
FUJINO, Junji
description A method for manufacturing a test piece for an adhesion evaluation test includes a process S 100 of preparing a semiconductor device and a process S200 of forming a test piece for an adhesion evaluation test. In the process S100 of preparing the semiconductor device, the semiconductor device includes a base member, a semiconductor element mounted on the base member, and a sealing resin to seal the base member and the semiconductor element. In the process S200 of forming the test piece for the adhesion evaluation test, the test piece for the adhesion evaluation test is formed on the base member from the sealing resin of the semiconductor device.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title METHOD FOR MANUFACTURING TEST PIECE FOR ADHESION EVALUATION TEST, AND ADHESION EVALUATION METHOD
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