SYSTEM AND METHOD FOR MANUFACTURING AND ASSEMBLING PACKAGED ELECTRONIC MODULES

A system and method of manufacturing and/or assembling packaged electronic modules for use with smart cards is disclosed. The packaged electronic modules may include contact plate(s), printed circuit(s) and/or value add components such as displays.

Bibliographische Detailangaben

Hauptverfasser:	POCHIC, Sebastien, LALO, Cyril, ESSEBAG, Jacques
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS
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