FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES

FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES

An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position whic...

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Hauptverfasser: Teng Hock, Kuah, Jian, Liao, Kar Weng, Yan, Rolan Ocuaman, Camba, Jiapei, Ding
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Teng Hock, Kuah
Jian, Liao
Kar Weng, Yan
Rolan Ocuaman, Camba
Jiapei, Ding
description An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
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