COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD
Transfer material supply units (13 and 14) for supplying a transfer material to a transfer table (80) and spreading the transfer material in a film shape on the transfer table is set in a free space of a feeder setting section (12) of a component mounting machine (10), and transfer pins (24 and 25)...
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| creator | HAMANE, Tsuyoshi ICHINO, Shinji IWAKI, Noriaki |
| description | Transfer material supply units (13 and 14) for supplying a transfer material to a transfer table (80) and spreading the transfer material in a film shape on the transfer table is set in a free space of a feeder setting section (12) of a component mounting machine (10), and transfer pins (24 and 25) for transferring the transfer material on the transfer table to a mounting surface (15a) of a three-dimensional board (15) are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle (23) for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface of the three-dimensional board by moving the mounting head above the mounting surface of the three-dimensional board to lower and raise the transfer pin. |
| format | Patent |
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The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface of the three-dimensional board by moving the mounting head above the mounting surface of the three-dimensional board to lower and raise the transfer pin.</description><language>eng ; fre ; ger</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230104&DB=EPODOC&CC=EP&NR=4084046A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230104&DB=EPODOC&CC=EP&NR=4084046A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAMANE, Tsuyoshi</creatorcontrib><creatorcontrib>ICHINO, Shinji</creatorcontrib><creatorcontrib>IWAKI, Noriaki</creatorcontrib><title>COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD</title><description>Transfer material supply units (13 and 14) for supplying a transfer material to a transfer table (80) and spreading the transfer material in a film shape on the transfer table is set in a free space of a feeder setting section (12) of a component mounting machine (10), and transfer pins (24 and 25) for transferring the transfer material on the transfer table to a mounting surface (15a) of a three-dimensional board (15) are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle (23) for picking up a circuit component. 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The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface of the three-dimensional board by moving the mounting head above the mounting surface of the three-dimensional board to lower and raise the transfer pin.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD |
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