HEAT DISSIPATION DEVICE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS

Embodiments of this application provide a heat dissipation apparatus, a circuit board assembly, and an electronic device. The heat dissipation apparatus is applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board, the heat dissipation apparatus includes...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEI, Longhe, CHEN, Jun, LI, Quanming, LIAN, Zhisheng
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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