METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

A method for manufacturing an electronic component is provided. The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRATA, Katsunori, NAKANO, Takahiro, SHIMOISHIZAKA, Nozomi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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