METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
A method for manufacturing an electronic component is provided. The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to...
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| creator | HIRATA, Katsunori NAKANO, Takahiro SHIMOISHIZAKA, Nozomi |
| description | A method for manufacturing an electronic component is provided. The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to the surface of the bonding substrate on which the bumps have been formed and/or to a surface of the mounted member on which the external conductive members have been formed; and a step for fixing the bonding substrate and the mounted member with the fixing material such that the bumps and the external conductive members come into contact. The step of applying the fixing material comprises: a step of preparing as the fixing material a material containing a first base compound having a characteristic of viscosity which changes depending on the temperature and a second base compound having a characteristic of viscosity which changes depending on the temperature; and a step of applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing step comprises: a step of pressing the bonding substrate against the mounted member when the temperature of the fixing material is lower than the first temperature; and a step of heating the fixing material to a temperature higher than the second temperature and curing the fixed material. |
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The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to the surface of the bonding substrate on which the bumps have been formed and/or to a surface of the mounted member on which the external conductive members have been formed; and a step for fixing the bonding substrate and the mounted member with the fixing material such that the bumps and the external conductive members come into contact. The step of applying the fixing material comprises: a step of preparing as the fixing material a material containing a first base compound having a characteristic of viscosity which changes depending on the temperature and a second base compound having a characteristic of viscosity which changes depending on the temperature; and a step of applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing step comprises: a step of pressing the bonding substrate against the mounted member when the temperature of the fixing material is lower than the first temperature; and a step of heating the fixing material to a temperature higher than the second temperature and curing the fixed material.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221019&DB=EPODOC&CC=EP&NR=4075485A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221019&DB=EPODOC&CC=EP&NR=4075485A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRATA, Katsunori</creatorcontrib><creatorcontrib>NAKANO, Takahiro</creatorcontrib><creatorcontrib>SHIMOISHIZAKA, Nozomi</creatorcontrib><title>METHOD FOR MANUFACTURING ELECTRONIC COMPONENT</title><description>A method for manufacturing an electronic component is provided. The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to the surface of the bonding substrate on which the bumps have been formed and/or to a surface of the mounted member on which the external conductive members have been formed; and a step for fixing the bonding substrate and the mounted member with the fixing material such that the bumps and the external conductive members come into contact. The step of applying the fixing material comprises: a step of preparing as the fixing material a material containing a first base compound having a characteristic of viscosity which changes depending on the temperature and a second base compound having a characteristic of viscosity which changes depending on the temperature; and a step of applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing step comprises: a step of pressing the bonding substrate against the mounted member when the temperature of the fixing material is lower than the first temperature; and a step of heating the fixing material to a temperature higher than the second temperature and curing the fixed material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPVxdQ4J8vfzdFZw9vcN8Pdz9QvhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmBuamJhamjobGRCgBAIxKJVU</recordid><startdate>20221019</startdate><enddate>20221019</enddate><creator>HIRATA, Katsunori</creator><creator>NAKANO, Takahiro</creator><creator>SHIMOISHIZAKA, Nozomi</creator><scope>EVB</scope></search><sort><creationdate>20221019</creationdate><title>METHOD FOR MANUFACTURING ELECTRONIC COMPONENT</title><author>HIRATA, Katsunori ; NAKANO, Takahiro ; SHIMOISHIZAKA, Nozomi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4075485A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRATA, Katsunori</creatorcontrib><creatorcontrib>NAKANO, Takahiro</creatorcontrib><creatorcontrib>SHIMOISHIZAKA, Nozomi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRATA, Katsunori</au><au>NAKANO, Takahiro</au><au>SHIMOISHIZAKA, Nozomi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING ELECTRONIC COMPONENT</title><date>2022-10-19</date><risdate>2022</risdate><abstract>A method for manufacturing an electronic component is provided. The method comprises: a step of preparing a bonding substrate on which a plurality of bumps are provided; a step of preparing a mounted member that has a plurality of external conductive members; a step of applying a fixing material to the surface of the bonding substrate on which the bumps have been formed and/or to a surface of the mounted member on which the external conductive members have been formed; and a step for fixing the bonding substrate and the mounted member with the fixing material such that the bumps and the external conductive members come into contact. The step of applying the fixing material comprises: a step of preparing as the fixing material a material containing a first base compound having a characteristic of viscosity which changes depending on the temperature and a second base compound having a characteristic of viscosity which changes depending on the temperature; and a step of applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing step comprises: a step of pressing the bonding substrate against the mounted member when the temperature of the fixing material is lower than the first temperature; and a step of heating the fixing material to a temperature higher than the second temperature and curing the fixed material.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT |
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