MICRO SEMICONDUCTOR CHIP TRANSFER SUBSTRATE, DISPLAY TRANSFER STRUCTURE USING SAME, DISPLAY DEVICE, AND DISPLAY DEVICE MANUFACTURING METHOD

According to an aspect of an embodiment, provided is a micro semiconductor chip transferring substrate including: a mold including a plurality of recesses formed to be recessed in a certain depth from an upper surface; and a surface energy reduction pattern formed in region between the plurality of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HWANG, Junsik, KIM, Hyunjoon, PARK, Joonyong, HWANG, Kyungwook, HONG, Seogwoo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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