ELECTROPLATING DEVICE AND PROCESS FOR DEPOSITING NICKEL ALLOYS WITH A SOLID REPLENISHER

The present invention refers to an electroplating device for depositing nickel alloys and a process for depositing nickel alloys on a substrate with a solid replenisher.

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Bibliographische Detailangaben
Hauptverfasser:	Tappe, Maik, Sahrhage, Holger, El Arrassi, Abdelilah, Wojczykowski, Klaus
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The present invention refers to an electroplating device for depositing nickel alloys and a process for depositing nickel alloys on a substrate with a solid replenisher.