POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM
A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass% or more and 40 mass% or less, and a mass ratio of water to the solvent other than water in the polyimide precurs...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | OKUBO, Tomoyo HIROSE, Hidekazu SEITOKU, Shigeru NAKADA, Kosuke SUGAHARA, Hajime IWANAGA, Takeshi |
description | A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass% or more and 40 mass% or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4063439B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4063439B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4063439B13</originalsourceid><addsrcrecordid>eNrjZHAI8PeJ9PT1dHFVCAhydQ4NCvYPUnDz9PFVcPRzUfB1DfHwd1FwA4oFBPm7hDp7-rkrIHSA1PEwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXABMDM2MTY0snQ2MilAAAaP8qXg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM</title><source>esp@cenet</source><creator>OKUBO, Tomoyo ; HIROSE, Hidekazu ; SEITOKU, Shigeru ; NAKADA, Kosuke ; SUGAHARA, Hajime ; IWANAGA, Takeshi</creator><creatorcontrib>OKUBO, Tomoyo ; HIROSE, Hidekazu ; SEITOKU, Shigeru ; NAKADA, Kosuke ; SUGAHARA, Hajime ; IWANAGA, Takeshi</creatorcontrib><description>A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass% or more and 40 mass% or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.</description><language>eng ; fre ; ger</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240131&DB=EPODOC&CC=EP&NR=4063439B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240131&DB=EPODOC&CC=EP&NR=4063439B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKUBO, Tomoyo</creatorcontrib><creatorcontrib>HIROSE, Hidekazu</creatorcontrib><creatorcontrib>SEITOKU, Shigeru</creatorcontrib><creatorcontrib>NAKADA, Kosuke</creatorcontrib><creatorcontrib>SUGAHARA, Hajime</creatorcontrib><creatorcontrib>IWANAGA, Takeshi</creatorcontrib><title>POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM</title><description>A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass% or more and 40 mass% or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAI8PeJ9PT1dHFVCAhydQ4NCvYPUnDz9PFVcPRzUfB1DfHwd1FwA4oFBPm7hDp7-rkrIHSA1PEwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXABMDM2MTY0snQ2MilAAAaP8qXg</recordid><startdate>20240131</startdate><enddate>20240131</enddate><creator>OKUBO, Tomoyo</creator><creator>HIROSE, Hidekazu</creator><creator>SEITOKU, Shigeru</creator><creator>NAKADA, Kosuke</creator><creator>SUGAHARA, Hajime</creator><creator>IWANAGA, Takeshi</creator><scope>EVB</scope></search><sort><creationdate>20240131</creationdate><title>POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM</title><author>OKUBO, Tomoyo ; HIROSE, Hidekazu ; SEITOKU, Shigeru ; NAKADA, Kosuke ; SUGAHARA, Hajime ; IWANAGA, Takeshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4063439B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>OKUBO, Tomoyo</creatorcontrib><creatorcontrib>HIROSE, Hidekazu</creatorcontrib><creatorcontrib>SEITOKU, Shigeru</creatorcontrib><creatorcontrib>NAKADA, Kosuke</creatorcontrib><creatorcontrib>SUGAHARA, Hajime</creatorcontrib><creatorcontrib>IWANAGA, Takeshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKUBO, Tomoyo</au><au>HIROSE, Hidekazu</au><au>SEITOKU, Shigeru</au><au>NAKADA, Kosuke</au><au>SUGAHARA, Hajime</au><au>IWANAGA, Takeshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM</title><date>2024-01-31</date><risdate>2024</risdate><abstract>A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass% or more and 40 mass% or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP4063439B1 |
source | esp@cenet |
subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
title | POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T21%3A20%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OKUBO,%20Tomoyo&rft.date=2024-01-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4063439B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |